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Free IPC-CID Practice Questions

10 free, exam-style IPC Certified Interconnect Designer (IPC-CID) practice questions with answers and explanations. No signup required. Work through them below, then take the full free IPC-CID practice test to study every exam domain.

These 10 free IPC-CID questions are organized by exam domain, so you can see how each part of the IPC Certified Interconnect Designer blueprint is tested. Reveal the answer and explanation under each question.

Domain 1: Chapter 1

Question 1

What are the three common names for a Printed Wiring Board?

  1. PWB, PCB, Printed Board
  2. Substrate, Laminate, Core
  3. Circuit Card, Motherboard, Daughtercard
  4. Etched Board, Milled Board, Additive Board
Show answer & explanation

Correct answer: A - PWB, PCB, Printed Board

Domain 2: Chapter 2

Question 2

The temperature at which a laminate's resin transitions from a rigid state to a softer, rubbery state is known as the:

  1. Decomposition Temperature (Td)
  2. Glass Transition Temperature (Tg)
  3. Coefficient of Thermal Expansion (CTE)
  4. Continuous Operating Temperature
Show answer & explanation

Correct answer: B - Glass Transition Temperature (Tg)

Domain 3: Chapter 3

Question 3

The side of the PCB that contains the most complex or largest number of components is now referred to as the:

  1. Solder Side
  2. Component Side
  3. Primary Side
  4. Layer One Side
Show answer & explanation

Correct answer: C - Primary Side

Domain 4: Chapter 4

Question 4

A component that can start, stop, or control the flow of current, such as a transistor, is classified as:

  1. Passive
  2. Active
  3. Integrated
  4. Discrete
Show answer & explanation

Correct answer: B - Active

Domain 5: Chapter 5

Question 5

The majority of IC packaging today uses what type of package?

  1. Through-hole
  2. Surface mount
  3. Press-fit
  4. Embedded
Show answer & explanation

Correct answer: B - Surface mount

Domain 6: Chapter 6

Question 6

Solder mask is a non-conductive polymeric material used to cover and protect:

  1. Component bodies
  2. The entire board surface, including pads
  3. Metal conductors (traces)
  4. Tooling holes
Show answer & explanation

Correct answer: C - Metal conductors (traces)

Domain 7: Chapter 7

Question 7

Which document in the documentation package specifies the materials, layer stackup, and hole sizes for the bare board?

  1. Assembly Drawing
  2. Bill of Materials
  3. Fabrication Drawing
  4. Schematic Diagram
Show answer & explanation

Correct answer: C - Fabrication Drawing

Domain 8: Chapter 8

Question 8

The first document a PCB designer usually encounters, which defines the electrical connectivity, is the:

  1. Assembly Drawing
  2. Fabrication Drawing
  3. Logic or Schematic Diagram
  4. Bill of Materials
Show answer & explanation

Correct answer: C - Logic or Schematic Diagram

Domain 9: Chapter 9

Question 9

The board fabrication drawing, which describes the bare, unpopulated board, is also referred to as the:

  1. Assembly Drawing
  2. Master Drawing
  3. Schematic Diagram
  4. Bill of Materials
Show answer & explanation

Correct answer: B - Master Drawing

Domain 10: Chapter 10

Question 10

Which document depicts the physical relationship of a design's components on an assembly?

  1. The Fabrication Drawing
  2. The Schematic Diagram
  3. The Assembly Drawing
  4. The Netlist
Show answer & explanation

Correct answer: C - The Assembly Drawing

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